On the boil: New nano technique significantly boosts boiling efficiency

Hyper-efficient boiling could lead to smaller computer chips, lower energy costs

A scanning electron microscope shows copper nanorods deposited on a copper substrate. Air trapped in the forest of nanorods helps to dramatically boost the creation of bubbles and the efficiency... Click here for more information.

Troy, N.Y. – Whoever penned the old adage "a watched pot never boils" surely never tried to heat up water in a pot lined with copper nanorods.

A new study from researchers at Rensselaer Polytechnic Institute shows that by adding an invisible layer of the nanomaterials to the bottom of a metal vessel, an order of magnitude less energy is required to bring water to boil. This increase in efficiency could have a big impact on cooling computer chips, improving heat transfer systems, and reducing costs for industrial boiling applications.

"Like so many other nanotechnology and nanomaterials breakthroughs, our discovery was completely unexpected," said Nikhil A. Koratkar, associate professor in the Department of Mechanical, Aerospace, and Nuclear Engineering at Rensselaer, who led the project. "The increased boiling efficiency seems to be the result of an interesting interplay between the nanoscale and microscale surfaces of the treated metal. The potential applications for this discovery are vast and exciting, and we're eager to continue our investigations into this phenomenon."

Bringing water to a boil, and the related phase change that transforms the liquid into vapor, requires an interface between the water and air. In the example of a pot of water, two such interfaces exist: at the top where the water meets air, and at the bottom where the water meets tiny pockets of air trapped in the microscale texture and imperfections on the surface of the pot. Even though most of the water inside of the pot has reached 100 degrees Celsius and is at boiling temperature, it cannot boil because it is surrounded by other water molecules and there is no interface — i.e., no air — present to facilitate a phase change.